In the fields of new energy vehicles, photovoltaic inverters, industrial transmissions, etc,IGBTAs the core power device, the long-term reliability of modules directly determines the safety and lifespan of terminal equipment.SMTThe cleaning of residual flux in the process isIGBTThe key process of packaging —— Failure to meet cleaning standards can pose significant risks such as short circuits, overheating, and failure; However, traditional cleaning methods have always been “Cleanliness, environmental friendliness, compatibility, cost” Difficult to balance, becomingIGBTThe core bottleneck of mass production.Dual solvent cleaning solution - using “Double solvent deep dissolution + Single solvent rinsing + Volatile condensation recovery” The synergistic mechanism improves cleanliness while achieving the recycling and reuse of volatile solvents, greatly reducing solvent loss.
The traditional single solvent cleaning solution requires rinsing with clean water, which generates a large amount of wastewater during the rinsing process. Subsequent wastewater treatment has always been a major challenge for production enterprises, and the high cost of wastewater treatment greatly increases their production costs.The new dual solvent cleaning solution uses volatile solvents for rinsing, and after rinsing, it naturally evaporates and dries. All volatile solvents are refluxed and filtered through a condensing device, which can be recycled. The cleaning process does not produce wastewater, solving the problem of wastewater treatment in traditional single solvent cleaning.

Advantages of dual solvent cleaning solution:
1、 Compatible with the vast majority of materials
2、 Specially designed for stubborn pollutants (suitable for high difficulty cleaning scenarios)
3、 For low standing distance / Low gap components exhibit excellent cleaning performance
4、 Fast drying speed, no residue after cleaning
5、 There is no risk of secondary oxidation during the drying process
6、 No ozone depletion potential (none)ODP)No Global Warming Potential (N/A)GWP), and non flammable
7、 The equipment occupies a smaller area
8、 No wastewater discharge issues
9、 Nitrogen free(N)And phosphorus(P)Elements
10、 Excellent wetting ability (low surface tension), andKBHigh value (strong solubility)

At present,The dual solvent cleaning solution has been widely applied in the semiconductor industry. For more case sharing, please contact Shanghai Mingchengjin Material Technology Co., Ltd
问:为什么 SMT/IGBT 封装后必须清洗助焊剂残留?
答:助焊剂残留吸湿导电,会引发短路、电化学迁移与腐蚀,埋下过热失效隐患;对 IGBT 等功率器件,清洗不达标直接威胁长期可靠性。因此清洗是封装关键工序。
问:双溶剂清洗方案相比单溶剂有什么优势?
答:双溶剂方案以“深度溶解+单溶剂漂洗+挥发物冷凝回收”协同,洗净度更高且溶剂循环复用、不产生废水;相比传统单溶剂清水漂洗,大幅降低废水处理成本与环保压力。
问:清洗剂如何兼顾洗净度与材料兼容性?
答:需对助焊剂强溶解(高 KB 值、低表面张力、优异润湿),同时与 PCB、阻焊、塑封、金属引脚等兼容。双溶剂方案设计上适配绝大多数材料,对低间隙组件清洗表现优异。
问:清洗过程如何做到环保无废水?
答:采用挥发型溶剂漂洗,漂洗后自然挥发干燥,挥发的溶剂经冷凝装置回流、过滤循环使用,全过程无废水排放,且无 ODP、无 GWP、不可燃,更环保。
问:清洗后如何验证洁净度是否达标?
答:常用离子残留(如 ROSE 测试)、表面绝缘电阻(SIR)、外观与颗粒检查,以及针对顽固污染物的专项检测。关键功率器件建议结合温湿偏置老化评估长期可靠性。
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