potting compound

电子灌封胶的常见类型和特点
Common types and characteristics of electronic potting adhesives
在我们工业生产中,为了提高产品的使用寿命和可靠性,经常会将PCB电路板进行灌封保护,起到防水、防尘、防腐蚀的作用。灌封胶广泛应用于大功率电子元器件、模块电源、线...
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灌封胶操作流程
Sealing adhesive operation process
The operation process of electronic sealing adhesive is as follows: 1. Clean the circuit board with anhydrous alcohol or special cleaning agent to remove residues such as soldering flux, solder balls, and other pollutants from the circuit board and shell. 2. Dry the components using a dryer or hot air duct to remove them ..
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