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Potting Compound

Performance, Application, and Technical Points of Epoxy Resin Encapsulation Adhesive for IGBT Module Packaging

With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. When the device operates at high frequency and high voltage, it generates a large amount of heat energy, which can easily affect the insulation performance of the packaging material, so it is sealed ..

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High performance epoxy potting adhesive: specialized for IGBT module packaging

Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacker, Sika, Cemedine, Dymax

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Common types and characteristics of electronic potting adhesives

In our industrial production, in order to improve the service life and reliability of products, PCB circuit boards are often sealed and protected to prevent water, dust, and corrosion. Sealing adhesive is widely used in high-power electronic components, module power supplies, and wires ..

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Sealing adhesive operation process

The operation process of electronic sealing adhesive is as follows: 1. Clean the circuit board with anhydrous alcohol or special cleaning agent to remove residues such as soldering flux, solder balls, and other pollutants from the circuit board and shell. 2. Dry the components using a dryer or hot air duct to remove them ..

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Potting Compound

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