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传感器灌封用什么胶不容易裂：降模量、控膨胀、抗冷热冲击三条路
传感器灌封用什么胶不容易裂：降模量、控膨胀、抗冷热冲击三条路
传感器灌封为什么容易开裂？上海铭诚锦从降低模量、控制膨胀、抗冷热冲击三条路径给方案，对照硅凝胶、柔性环氧与刚性环氧的应力差异，并讲清换胶之外的结构与工艺手段，附...
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需要导热，灌封胶怎么挑：0.73、1.2、2.0、4.0 W/mK 四档各对应什么场景
需要导热，灌封胶怎么挑：0.73、1.2、2.0、4.0 W/mK 四档各对应什么场景
导热灌封胶怎么挑？上海铭诚锦对照 0.73 到 4.0 W/mK 四档，讲清各档对应的材质与适用场景，说明灌封、填缝、导热粘接与垫片的分工，并给出温升实测和剖切...
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汽车电子灌封胶怎么选：控制器、传感器、电机、车灯与功率模块五类部位
汽车电子灌封胶怎么选：控制器、传感器、电机、车灯与功率模块五类部位
汽车电子灌封胶怎么选？上海铭诚锦按控制器 PIN 针、传感器、驱动电机、车灯线束、功率模块五类部位给方案，讲清各部位该看硬度还是看导热，附 APQP 六阶段文件...
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灌封胶选环氧还是聚氨酯：按硬度、耐温、抗振和固化条件四条线对照
灌封胶选环氧还是聚氨酯：按硬度、耐温、抗振和固化条件四条线对照
灌封胶选环氧还是聚氨酯？上海铭诚锦按硬度与应力、耐温、抗振、固化条件四条线对照，列出 EE-100、RE602 等型号的硬度与配比，讲清什么时候走刚性体系、什么...
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电子灌封胶怎么选：先看材质与固化条件，再核导热、阻燃和施胶工艺
电子灌封胶怎么选：先看材质与固化条件，再核导热、阻燃和施胶工艺
电子灌封胶怎么选？上海铭诚锦给出四步顺序：先分环氧、聚氨酯、有机硅三条材质线，再对上产线的室温、加热或 UV 固化条件，接着核导热与阻燃档位，最后看施胶方式与用...
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IGBT模块封装环氧树脂灌封胶性能、应用及技术要点
Performance, Application, and Technical Points of Epoxy Resin Encapsulation Adhesive for IGBT Module Packaging
IGBT 模块封装怎么选灌封胶？上海铭诚锦梳理环氧灌封胶的性能指标、与有机硅凝胶的搭配用法及应用要点，供功率器件封装选型参考。
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灌封胶和三防漆的区别：一张表看懂 8 个维度怎么选
灌封胶和三防漆的区别：一张表看懂 8 个维度怎么选
灌封胶和三防漆怎么选？上海铭诚锦用 8 大维度对照表讲清防护原理、涂层厚度、机械保护、散热与维修返工，附决策路径和常见问题。
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高导热环氧灌封胶与耐高温环氧灌封胶的区别：能互相替代吗？
The difference between high thermal conductivity epoxy sealant and high temperature resistant epoxy sealant: can they replace each other?
上海铭诚锦解析高导热环氧灌封胶与耐高温环氧灌封胶的核心区别：导热系数、Tg、长期耐温与应用场景不同，二者不能互相替代，选型需看 datasheet 硬指标。
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高性能环氧灌封胶：IGBT 模块封装专用
High performance epoxy potting adhesive: specialized for IGBT module packaging
Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacker, Sika, Cemedine, Dymax
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电子灌封胶的常见类型和特点
Common types and characteristics of electronic potting adhesives
In our industrial production, in order to improve the service life and reliability of products, PCB circuit boards are often sealed and protected to prevent water, dust, and corrosion. Sealing adhesive is widely used in high-power electronic components, module power supplies, and wires ..
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灌封胶操作流程
Sealing adhesive operation process
The operation process of electronic sealing adhesive is as follows: 1. Clean the circuit board with anhydrous alcohol or special cleaning agent to remove residues such as soldering flux, solder balls, and other pollutants from the circuit board and shell. 2. Dry the components using a dryer or hot air duct to remove them ..
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