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什么是灌封胶？

Encapsulation is the use of polymer insulation materials to fill electronic devices, strengthen the integrity of electronic devices, improve resistance to external impacts and vibrations, while avoiding direct exposure of components and circuits, improving the waterproof and moisture-proof performance of devices, and enhancing their performance and lifespan.

model	material	color	ratio	viscosity	hardness	solidify	remark
EE-100	环氧树脂	black	100：100	9000 mPa·s	Shore D 93	heat curing
UF-1113	聚氨酯	black	重量比 20：100	2150 mPa·s	Shore A 42	加热+室温
UF-1268	聚氨酯	black	重量比 25：100	2400 mPa·s	Shore A 49	加热+室温
5879	环氧树脂	灰色	100:75	1400 mPa·s	/	heat curing	高导热1.2W/m·K
229	环氧树脂	棕红	1:1	3000 mPa·s	/	heat curing	耐高温200℃
RE531-(96)	聚氨酯	black	重量比 100：14	1650 mPa·s	Shore D 53	室温固化	耐高温150℃
RE602	聚氨酯	black	1:1	6500 mPa·s	Shore D 57	室温固化	通孔不流淌
RE461-(97)	聚氨酯	black	5:1	1100 mPa·s	Shore D 46	室温固化
RE501	聚氨酯	black	重量比 100：10	2200 mPa·s	Shore A 57	heat curing
949UV A/B	silicone	透明	100：10	200 mPa·s	Shore00 40	UV固化
915HT	silicone	透明	10:1	1000 mPa·s	Shore00 10	加热或UV	耐高温210℃
912	silicone	透明	10:1	1000 mPa·s	锥入度60mm/10	UV或加热
612	silicone	透明	1:1	1000 mPa·s	锥入度300 mm/10	加热或室温

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什么是灌封胶？

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