What is sealant?
Encapsulation is the use of polymer insulation materials to fill electronic devices, strengthen the integrity of electronic devices, improve resistance to external impacts and vibrations, while avoiding direct exposure of components and circuits, improving the waterproof and moisture-proof performance of devices, and enhancing their performance and lifespan.
| model | material | color | ratio | viscosity | hardness | solidify | remark |
|---|
| EE-100 |
epoxy resin |
black |
100：100 |
9000 mPa·s |
Shore D 93 |
heat curing |
|
| UF-1113 |
polyurethane |
black |
Weight ratio 20:100 |
2150 mPa·s |
Shore A 42 |
Heating+room temperature |
|
| UF-1268 |
polyurethane |
black |
Weight ratio 25:100 |
2400 mPa·s |
Shore A 49 |
Heating+room temperature |
|
| 5879 |
epoxy resin |
grey |
100:75 |
1400 mPa·s |
/ |
heat curing |
High thermal conductivity 1.2W/m · K |
| 229 |
epoxy resin |
reddish brown |
1:1 |
3000 mPa·s |
/ |
heat curing |
High temperature resistance up to 200°C |
| RE531-(96) |
polyurethane |
black |
Weight ratio 100:14 |
1650 mPa·s |
Shore D 53 |
room temperature curing |
High temperature resistance of 150 ℃ |
| RE602 |
polyurethane |
black |
1:1 |
6500 mPa·s |
Shore D 57 |
room temperature curing |
The through-hole does not flow |
| RE461-(97) |
polyurethane |
black |
5:1 |
1100 mPa·s |
Shore D 46 |
room temperature curing |
|
| RE501 |
polyurethane |
black |
Weight ratio 100:10 |
2200 mPa·s |
Shore A 57 |
heat curing |
|
| 949UV A/B |
silicone |
transparent |
100：10 |
200 mPa·s |
Shore00 40 |
UV curing |
|
| 915HT |
silicone |
transparent |
10:1 |
1000 mPa·s |
Shore00 10 |
Heating or UV |
High temperature resistance of 210 ℃ |
| 912 |
silicone |
transparent |
10:1 |
1000 mPa·s |
Cone penetration 60mm/10 |
UV or heating |
|
| 612 |
silicone |
transparent |
1:1 |
1000 mPa·s |
Cone penetration of 300 mm/10 |
Heating or room temperature |
|
