CIPG密封胶和FIPG密封胶具有耐高温、耐腐蚀的特点，还具有良好的耐候性和抗振动性能。CIPG 密封胶是一种‌现场固化成型‌的密封材料，CIPG意为现场成型密...

Performance, Application, and Technical Points of Epoxy Resin Encapsulation Adhesive for IGBT Module Packaging

With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. When the device operates at high frequency and high voltage, it generates a large amount of heat energy, which can easily affect the insulation performance of the packaging material, so it is sealed ..

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High performance epoxy potting adhesive: specialized for IGBT module packaging

Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacker, Sika, Cemedine, Dymax

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IGBT new cleaning solution: dual solvent cleaning, deep cleaning, green and environmentally friendly

Inventec's dual solvent cleaning solution adopts a synergistic mechanism of "dual solvent deep dissolution+single solvent rinsing+volatile matter condensation recovery" to improve cleanliness while achieving the recycling and reuse of volatile solvents, greatly improving efficiency ..

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Common salt spray testing methods for automotive electronic control sealants

With the continuous maturity of China's new energy vehicle industry, the performance verification of sealants used in electronic control is becoming more and more perfect. Especially in recent years, more and more electronic control manufacturers have put forward requirements for salt spray testing of sealants.

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What are the thermal interface materials? What is the difference between them?

Thermal interface material is a new type of industrial material designed in recent years to meet the thermal conductivity requirements of equipment. Through thermal interface material, the heat on the heating components is dissipated faster, ensuring the safe and stable operation of the components. Thermal interface material matching ..

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Common types and characteristics of electronic potting adhesives

In our industrial production, in order to improve the service life and reliability of products, PCB circuit boards are often sealed and protected to prevent water, dust, and corrosion. Sealing adhesive is widely used in high-power electronic components, module power supplies, and wires ..

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Sealing adhesive operation process

The operation process of electronic sealing adhesive is as follows: 1. Clean the circuit board with anhydrous alcohol or special cleaning agent to remove residues such as soldering flux, solder balls, and other pollutants from the circuit board and shell. 2. Dry the components using a dryer or hot air duct to remove them ..

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Classification of Three Anti Paint Systems

The basic components of three proof paint/adhesive are polyurethane, epoxy resin, and acrylic acid. It can be diluted with diluent in a certain proportion to ensure that the performance of the paint film is greatly improved.

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Removal method of three proof paint coating

With the increasing application of three proof paint, the curing of the three proof paint may involve the repair of circuit boards, cleaning of product carriers or fixtures, etc. How to remove the cured three proof coating has always been a concern for people. At present, the main methods for removing three proof paint coatings are ..

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