What is thermal conductive adhesive?
Thermal conductive adhesive can quickly conduct heat, reduce component temperature, and ensure circuit safety. Thermal conductive adhesive is mainly divided into three forms according to its application: thermal conductive joint filling, thermal conductive bonding, thermal conductive silicone grease, and thermal conductive sealing. In addition, there are also customizable sizes of thermal conductive gaskets. According to the type of substrate, it can be divided into silicone material and non silicone material. Thermal conductive adhesive is currently widely used for heat dissipation in fields such as electronics, automobiles, and machinery.
| model | material | ratio | viscosity | hardness | solidify | 导热率 | 应用 |
| RH96L |
MS |
单组份 |
250000 mPa・s |
ShoreA 65 |
room temperature curing |
2.35W/m・k |
导热粘接 |
| 9620TC A/B |
silicone |
1:1 |
180000 mPa·s |
Shore00 50 |
加热或室温固化 |
2.0 W/mK |
导热填缝 |
| 9639TC A/B |
silicone |
1:1 |
140000 mPa·s |
Shore00 60 |
加热或室温 |
3.0 W/mK |
导热填缝 |
| 9649TC A/B |
silicone |
1:1 |
145000 mPa·s |
Shore00 65 |
加热或室温 |
4.0 W/mK |
导热填缝 |
| 9679TC A/B |
silicone |
1:1 |
210000 mPa·s |
Shore00 60 |
加热或室温 |
7.0 W/mK |
导热填缝 |
| 9720TC |
silicone |
单组份 |
150000 mPa·s |
ShoreA 82 |
heat curing |
2.0 W/mK |
导热粘接 |
| 7620TC A/B |
silicone |
1:1 |
5900 mPa·s |
Shore00 50 |
加热或室温 |
2.0 W/mK |
导热灌封 |
| 9669TC A/B |
silicone |
1:1 |
12000 mPa·s |
Shore00 56 |
heat curing |
6.0 W/mK |
导热填缝 |