What is thermal conductive adhesive?
Thermal conductive adhesive can quickly conduct heat, reduce component temperature, and ensure circuit safety. Thermal conductive adhesive is mainly divided into three forms according to its application: thermal conductive joint filling, thermal conductive bonding, thermal conductive silicone grease, and thermal conductive potting. In addition, there are also customizable sizes of thermal conductive gaskets. According to the type of substrate, it can be divided into silicone material and non silicone material. Thermal conductive adhesive is currently widely used for heat dissipation in fields such as electronics, automobiles, and machinery.
| model | material | ratio | viscosity | hardness | solidify | thermal conductivity | application |
|---|
| CSTCG-601 |
Non-silicon |
single-component |
30000 mPa·s |
/ |
/ |
10 W/mK |
Thermal conductive joint filling |
| RH96L |
MS |
single-component |
250000 mPa･s |
ShoreA 65 |
room temperature curing |
2.35W/m･k |
Thermal conductive adhesive |
| 9620TC A/B |
silicone |
1:1 |
180000 mPa·s |
Shore00 50 |
Heating or room temperature curing |
2.0 W/mK |
Thermal conductive joint filling |
| 9639TC A/B |
silicone |
1:1 |
140000 mPa·s |
Shore00 60 |
Heating or room temperature |
3.0 W/mK |
Thermal conductive joint filling |
| 9649TC A/B |
silicone |
1:1 |
145000 mPa·s |
Shore00 65 |
Heating or room temperature |
4.0 W/mK |
Thermal conductive joint filling |
| 9679TC A/B |
silicone |
1:1 |
210000 mPa·s |
Shore00 60 |
Heating or room temperature |
7.0 W/mK |
Thermal conductive joint filling |
| 9720TC |
silicone |
single-component |
150000 mPa·s |
ShoreA 82 |
heat curing |
2.0 W/mK |
Thermal conductive adhesive |
| 7620TC A/B |
silicone |
1:1 |
5900 mPa·s |
Shore00 50 |
Heating or room temperature |
2.0 W/mK |
Thermal sealing |
| 9669TC A/B |
silicone |
1:1 |
12000 mPa·s |
Shore00 56 |
heat curing |
6.0 W/mK |
Thermal conductive joint filling |
