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Wacker 9649TC Thermal Filler 4-watt Thermal Adhesive 9649TC A/B

Wacker SEMICOSIL 9649TC A/B is a two-component room temperature cured silicone thermal conductive joint filler with low stress, soft and self-adhesive surface, low density, and thermal conductivity of 4.0W/mK. It can be used for thermal conductive joint filling of new energy vehicle components

Key Features:

Organic silicon thermal conductive sealant
Low stress, soft and self-tacky surface
Two component, room temperature curing
4.0 W/mK thermal conductivity

Application Industry

Automobile, general industry

Application products:

Controller thermal conductivity, chip heat dissipation

Product performance

Instructions for Use

使用说明

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常见问题(FAQ)

问:导热胶/导热脂主要有哪些类型?

答:常见有导热硅脂、导热硅胶(垫片/凝胶)、导热环氧与导热聚氨酯等。非硅导热脂(如 CSTCG 系列)避免硅油迁移污染;导热垫片便于贴合装配;导热环氧兼顾粘接与散热。

问:导热系数(W/mK)越高越好吗?

答:不一定。高导热往往伴随更高硬度、更低绝缘性或更高成本。应结合芯片功率密度、界面间隙与装配压力选择,重点是降低整体热阻(界面接触电阻常比材料本体更关键)。

问:非硅导热脂与硅系导热材料怎么选?

答:对光学器件、传感器等怕硅油污染的场景选非硅导热脂;普通功率器件可用硅系以获更好润湿与长期稳定性。非硅体系(如 10W/mK 高导热脂)可在 -54~+150℃ 长期工作,适合消费电子与家电芯片散热。

问:导热界面材料施工需要注意什么?

答:关键是排除界面空气、保证均匀薄层。施工前清洁表面,控制涂覆/贴合压力使材料充分润湿;避免过量导致溢胶短路或厚度不均。自动化点胶可提升一致性与良率。

问:导热材料如何兼顾绝缘与散热?

答:功率器件常要求既导热又绝缘。应选电绝缘达标(高体积电阻、高耐电压、高 CTI)的导热材料,并验证在工况温度下的介电性能,避免热路径与电气隔离冲突。

Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap

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