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Wacker 9679TC Thermal Filler 7-watt Thermal Adhesive 9679TC A/B

Wacker SEMICOSIL 9679TC A/B is a two-component room temperature cured silicone thermal conductive joint filler with low stress, soft and self-adhesive surface, low density, and thermal conductivity of 7.0W/mK. It can be used for thermal conductive joint filling of new energy vehicle components

Key Features:

Organic silicon thermal conductive sealant
Low stress, soft and self-tacky surface
Two component, room temperature curing
7.0 W/mK thermal conductivity

Application Industry

Automobile, general industry

Application products:

Controller thermal conductivity, chip heat dissipation

Free access to adhesive solutions

Online Consultation

Product performance

固化前性能

固化后性能

Instructions for Use

使用说明

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