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Wacker 9669TC thermal sealant, 6-watt thermal adhesive 9669TC A/B

Wacker SEMICOSIL 9669TC A/B is a two-component room temperature cured silicone thermal conductive joint filler with low stress, soft and self-adhesive surface, low density, and a thermal conductivity of 6.0W/mK. It can be used for thermal conductive joint filling of new energy vehicle components

Key Features:

Organic silicon thermal conductive sealant
Low stress, soft and self-tacky surface
Two component, room temperature curing
6.0 W/mK thermal conductivity

Application Industry

Automobile, general industry

Application products:

Controller thermal conductivity, chip heat dissipation

Product performance

Wacker 9669TC导热填缝剂固化前性能

Wacker 9669TC导热填缝剂固化后性能

Instructions for Use

Wacker 9669TC导热胶使用说明

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Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap

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