Adhesive, Techniques, Equipment, Consumables, fully meet customers' needs

Keeping up with the new trends of industrial development and constantly exploring new demands
Gradually diversify the product line and customize products according to customers' special needs

Your location: Home page > Product> Potting Compound

Huntsman Araldite 5879 epoxy sealant with high thermal conductivity of 1.2W/m · K5879

Huntsman Araldite CW5879 CI/HW5879 CI is a high thermal conductivity epoxy resin sealant that is resistant to thermal shock, cracking, and high insulation. Also has a thermal conductivity of 1.2W/mK

Key Features:

Epoxy resin insulation adhesive;
High thermal conductivity;
Resistant to high and low temperature impacts ranging from -40 to 180 ℃;
Good heat resistance;
Excellent mechanical and electrical insulation performance;
Flame retardant through UL94 V0

Application Industry

Electricity, automotive, general industry

Application products:

Motor encapsulation, transformer encapsulation, eddy current sensor encapsulation

Free access to adhesive solutions

Online Consultation

Product performance

固化前性能

固化后性能

Instructions for Use

The issue that everyone is concerned about

CIPG密封胶与FIPG密封胶的区别详解

CIPG密封胶和FIPG密封胶具有耐高温、耐腐蚀的特点，还具有良好的耐候性和抗振动性能。CIPG 密...

2026-06-13

Performance, Application, and Technical Points of Epoxy Resin Encapsulation Adhesive for IGBT Module Packaging

With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..

2026-05-23

High performance epoxy potting adhesive: specialized for IGBT module packaging

Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke

2026-05-14