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Wacker 912 silicon gel encapsulation UV or heat curing 912

Wacker SEMICOSIL 912 is a two-component 10:1 silicon gel that can be used with different curing agents to achieve heat curing or UV curing. Low viscosity, low hardness, widely used for packaging and protection of sensors and electronic components.

Key Features:

Two component, mixed in a 10:1 ratio;
Low viscosity;
Low hardness;
Can be heat cured or UV cured.

Application Industry

car

Application products:

Component encapsulation; Sensor encapsulation.

Product performance

Instructions for Use

使用说明

The issue that everyone is concerned about

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常见问题(FAQ)

问:常见灌封胶有哪几种类型,各有什么特点?

答:主要有环氧树脂、有机硅(硅胶)与聚氨酯三类。环氧粘接强、绝缘好但固化应力大;有机硅耐温耐候优、应力小、可返修但附着力偏弱;聚氨酯柔韧耐低温、性价比高但对水敏感。选型需结合工况权衡。

问:环氧树脂、有机硅、聚氨酯灌封胶怎么选?

答:对绝缘强度和粘接强度要求高(如点火线圈、电力电机)选环氧;对耐温循环、抗震和可返修要求高(如通讯、车载电源)选有机硅;非高温、成本敏感场景(如线束、传感器)选聚氨酯。铭诚锦可按模块类型匹配牌号。

问:灌封工艺需要注意哪些关键点?

答:关键在配胶比例准确、充分脱泡、控制胶温和固化曲线。建议真空灌封消除气泡,双组分严格按重量/体积比混合;对深腔或大面积注意放热峰,必要时分层固化以避免开裂与应力损伤元器件。

问:灌封胶的绝缘与导热性能如何权衡?

答:通常导热与绝缘需兼顾:导热填料(氧化铝、氮化硼等)提升导热但过量会拉低绝缘性能或增稠。车载 OBC、DC-DC、IGBT 等功率模块需选用高导热且电气绝缘达标的产品,并验证 CTI、耐电压等参数。

问:灌封后如何返修与去除?

答:有机硅灌封一般可机械剥离或加热软化后清除,便于返修;环氧固化后交联致密,返修较难,常需加热或专用剥离工具。设计阶段建议预留维修通道或选用可返修体系,降低售后成本。

Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap

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