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Sealing adhesive operation process

Source: Mingcheng Brocade

Date: September 12, 2025

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电子灌封胶操作流程如下：

1、清洁线路板

Clean the circuit board and casing with anhydrous alcohol or specialized cleaning agents to remove residues such as soldering flux, solder balls, and other contaminants.

2、干燥

用烘干机或者热风筒烘干器件，除去器件的湿气，以免器件中的湿气影响灌封效果。

3、灌封

手工或用设备将灌封胶一次或多次填充进电路板外壳，注意不要存在死角，且胶尽量平整美观。

4. Curing

Heating or room temperature curing

5、检测

检测电路板功能是否正常

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Sealing adhesive operation process

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