Sealing adhesive operation process

The operation process of electronic sealing adhesive is as follows:

1. Clean the circuit board

Clean the circuit board and casing with anhydrous alcohol or specialized cleaning agents to remove residues such as soldering flux, solder balls, and other contaminants.

2. Dry

Dry the components with a dryer or hot air duct to remove moisture from the components and prevent it from affecting the sealing effect.

3. Encapsulation

Manually or using equipment to fill the sealing glue into the circuit board casing one or more times, taking care not to have blind spots, and the glue should be as smooth and beautiful as possible.

4. Curing

Heating or room temperature curing

5. Testing

Check if the circuit board is functioning properly