CIPG密封胶和FIPG密封胶具有耐高温、耐腐蚀的特点,还具有良好的耐候性和抗振动性能。CIPG 密...
Key Features:
Organic silicon thermal conductive sealant;
Two component, 1:1 mixture;
Room temperature curing;
Low stress, soft and surface self-adhesive;
Low density;
Application Industry
Automobile, general industry
Application products:
Controller thermal conductivity; HUD thermal conductivity; Chip thermal conductivity; Thermal conductivity sealing for power components



CIPG密封胶和FIPG密封胶具有耐高温、耐腐蚀的特点,还具有良好的耐候性和抗振动性能。CIPG 密...
With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap