Inventec dual solvent cleaning solution - using a combination of "dual solvent deep dissolution+single solvent rinsing+volatile condensation recovery" ..
Key Features:
硅凝胶灌封材料;
双组份,10:1混合;
低粘度;;
Low hardness (shore 00);
搭配不同固化剂可灵活调节固化方式;
High temperature resistance of 210 ℃.
Application Industry
汽车、半导体
Application products:
IGBT; Encapsulation of power modules such as SIC; Semiconductor packaging.



Inventec dual solvent cleaning solution - using a combination of "dual solvent deep dissolution+single solvent rinsing+volatile condensation recovery" ..
With the continuous maturity of China's new energy vehicle industry, the performance verification of sealants used in electronic control is becoming more and more perfect, especially in recent years ..
Thermal interface material is a new type of industrial material designed in recent years to meet the thermal conductivity requirements of equipment. It uses thermal interface material to connect heating components ..
Copyright: Shanghai Mingchengjin Material Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap