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Wacker 915HT silicon gel encapsulation high temperature resistant 210 ℃ 915HT

WAKE SEMICOSIL 915HT is a high temperature resistant silicon gel, which can maintain excellent performance at 210 ℃ for a long time The main agent 915HT can be combined with different curing agents to achieve heating or UV curing, meeting different process requirements

Key Features:

Silicon gel potting material;
Two component, 10:1 mixture;
Low viscosity;;
Low hardness (shore 00);
By combining different curing agents, the curing method can be flexibly adjusted;
High temperature resistance of 210 ℃.

Application Industry

Automobiles, semiconductors

Application products:

IGBT; Encapsulation of power modules such as SIC; Semiconductor packaging.

Product performance

Instructions for Use

使用说明

The issue that everyone is concerned about

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常见问题(FAQ)

问:常见灌封胶有哪几种类型,各有什么特点?

答:主要有环氧树脂、有机硅(硅胶)与聚氨酯三类。环氧粘接强、绝缘好但固化应力大;有机硅耐温耐候优、应力小、可返修但附着力偏弱;聚氨酯柔韧耐低温、性价比高但对水敏感。选型需结合工况权衡。

问:环氧树脂、有机硅、聚氨酯灌封胶怎么选?

答:对绝缘强度和粘接强度要求高(如点火线圈、电力电机)选环氧;对耐温循环、抗震和可返修要求高(如通讯、车载电源)选有机硅;非高温、成本敏感场景(如线束、传感器)选聚氨酯。铭诚锦可按模块类型匹配牌号。

问:灌封工艺需要注意哪些关键点?

答:关键在配胶比例准确、充分脱泡、控制胶温和固化曲线。建议真空灌封消除气泡,双组分严格按重量/体积比混合;对深腔或大面积注意放热峰,必要时分层固化以避免开裂与应力损伤元器件。

问:灌封胶的绝缘与导热性能如何权衡?

答:通常导热与绝缘需兼顾:导热填料(氧化铝、氮化硼等)提升导热但过量会拉低绝缘性能或增稠。车载 OBC、DC-DC、IGBT 等功率模块需选用高导热且电气绝缘达标的产品,并验证 CTI、耐电压等参数。

问:灌封后如何返修与去除?

答:有机硅灌封一般可机械剥离或加热软化后清除,便于返修;环氧固化后交联致密,返修较难,常需加热或专用剥离工具。设计阶段建议预留维修通道或选用可返修体系,降低售后成本。

Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap

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