CIPG密封胶和FIPG密封胶具有耐高温、耐腐蚀的特点,还具有良好的耐候性和抗振动性能。CIPG 密...
Key Features:
Silicon gel potting material;
Two component, 10:1 mixture;
Low viscosity;;
Low hardness (shore 00);
By combining different curing agents, the curing method can be flexibly adjusted;
High temperature resistance of 210 ℃.
Application Industry
Automobiles, semiconductors
Application products:
IGBT; Encapsulation of power modules such as SIC; Semiconductor packaging.



CIPG密封胶和FIPG密封胶具有耐高温、耐腐蚀的特点,还具有良好的耐候性和抗振动性能。CIPG 密...
With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap