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低挥发密封胶 D595 光通讯模块cover固定低挥发密封胶

This product is a low volatility adhesive that meets ASTM E595 testing requirements. It is heat cured and has strong adhesive strength, making it suitable for bonding PEI and PCB

Key Features:

单组份;
加热固化;
Low volatility, meeting ASTM E595 standards;
高粘接强度

Application Industry

光通讯

Application products:

Fixed optical module cover

Free access to adhesive solutions

Online Consultation

Product performance

固化前性能

固化后性能

使用说明

Instructions for Use

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