Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Key Features:
One component thixotropic adhesive
High elasticity and moderate hardness;
Rapid thermal curing;
Excellent low permanent compression deformation;
Has good no primer adhesion to multiple substrates
Application Industry
car
Application products:
Applied to FIPG and CIPG sealing processes; ABS controller sealing; Sealing of motor controller.



Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
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Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap