With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
Key Features:
Single component;
Thixotropy;
High flexibility and low stress;
Excellent bonding strength
Application Industry
car
Application products:
FIPG process sealant; Various types of shell seals; Universal sealing and bonding in the electronics industry; Chip bonding



With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Inventec dual solvent cleaning solution - using a combination of "dual solvent deep dissolution+single solvent rinsing+volatile condensation recovery" ..
Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap