Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Key Features:
Two component, 1:4 mixture;
Excellent thermal conductivity;
Low stress, resistant to mechanical impact;
Low temperature (-40 ℃) to maintain flexibility, temperature resistance to 130 ℃, and resistance to thermal shock test;
Room temperature curing, or heating can accelerate curing;
UL-94 V-0 flame retardant certification;
Thermal conductivity 0.5W/mK
Application Industry
Automobiles, motorcycles, general industry
Application products:
Controller encapsulation, sensor encapsulation



Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
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Copyright: Shanghai Maxcess Materials Technology Co., Ltd Record number: Shanghai ICP No. 11019525-1sitemap