High performance epoxy sealant: IGBT mold ..Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacke
Sealing adhesive operation processThe operation process of electronic sealing adhesive is as follows: 1. Clean the circuit board with anhydrous alcohol or special cleaning agent to remove residual flux, solder balls, etc ..
IGBT module encapsulation with epoxy resin sealant ..With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. High frequency components ..
