With the iteration and upgrading of semiconductor power device technology, IGBT insulated gate bipolar transistors are gradually developing towards high voltage and high switching frequency. When the device operates at high frequency and high voltage, it generates a large amount of heat energy, which can easily affect the insulation performance of the packaging material, so it is sealed ..
Shanghai Mingchengjin Material Technology Co., Ltd. introduces the core advantages and application points of epoxy potting adhesive in IGBT module packaging. Managing Wacker, Sika, Cemedine, Dymax
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