Wacker 9649TC导热填缝剂 4瓦导热胶
瓦克SEMICOSIL 9649TC A/B是一款双组份室温固化有机硅导热填缝剂,低应力,柔软且表面自粘,密度低,导热率4.0W/mK.可用于新能源汽车零部件导热填缝.
Wacker 9679TC Thermal Filler 7-watt Thermal Adhesive
Wacker SEMICOSIL 9679TC A/B is a two-component room temperature cured silicone thermal conductive joint filler with low stress, soft and self-adhesive surface, low density, and thermal conductivity of 7.0W/mK. It can be used for thermal conductive joint filling of new energy vehicle components
Wacker 9720TC Thermal Conductive Adhesive 2-watt Thermal Conductive
瓦克SEMICOSIL 9720TC是一款单组份加热固化导热粘接胶,导热率2W/mK,具有优异的抗震性,适合用于汽车底盘ECU的散热
Wacker RT 725LV sealing silicone high-strength
瓦克ELASTOSIL RT 725LV是一款双组份1:1混合膏状密封硅胶。产品具有触变性，中等硬度，低温快速固化。优异的粘结强度，高机械强度。
Wacker ELASTOSIL E43 adhesive silicone medical grade
Wacker ELASTOSIL E43 is a single component room temperature curing silicone gel that does not collapse and self leveling, with excellent bonding strength, especially for silicone rubber, medical grade.
Wacker SEMICOSIL 987 Sealed Silicone Low Stress
Wacker SEMICOSIL 987 is a single component sealing silicone. The product has thixotropy, high flexibility, low stress, and excellent bonding strength.
Wacker 612 silicon gel potting mechanical damping
Wacker SilGel 612 A/B is a two-component rapid heat curing silicone gel potting adhesive. Low viscosity, low hardness, completely transparent, with excellent intrinsic viscosity and outstanding mechanical damping performance. Can be used for chip encapsulation, IGBT encapsulation, damping products, etc
Wacker 989/1K sealing silicone low stress
瓦克SEMICOSIL 989/1K是一款单组份密封硅胶，产品中等硬度，具有触变性，高柔韧性，低应力，优异的粘结强度。
WACKER 942UV固化有机硅三防漆 耐高压
Wacker 942UV A/B is a UV activated cured silicone three proof paint with low viscosity and shear thinning, making it easy to apply. Fast curing speed, soft film formation, vibration resistance, and high voltage resistance. Very suitable for three proof coating of new energy vehicle circuit boards.
Wacker RT7620 TC high thermal conductivity sealant
瓦克ELASTOSIL RT7620TC A/B CN是一款双组分导热灌封胶，具有良好的流动性，优异的导热性，导热率2.0W/mK。可用于功率元器件的导热灌封。
