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Wacker 988/1K sealing silicone with high resilience, low permanent deformation

Wacker SEMICOSIL 988/1K is a single component thixotropic adhesive with high elasticity, moderate hardness, rapid heat curing, excellent low and long-term compression deformation, and good no primer adhesion to various substrates

Wacker ELASTOSIL E4 sealing silicone with high rebound

Wacker E4 is a single component sealed silicone gel that solidifies after deacidification at room temperature. The product has no collapse, low hardness after curing, excellent resilience, and good bonding strength with various substrates. Can be used as CIPG application

Wacker RT 7251 CN Sealing Silicone High Strength

Wacker ELASTOSIL RT 7251 CN is a two-component 1:1 mixed paste sealing silicone gel. The product has thixotropy, moderate hardness, and fast curing at low temperatures. Excellent bonding strength and high mechanical strength.

ELASTOSIL®N9111 silicone is non-slump

Wacker ELASTOSIL N9111 is a single component, dealcoholized cured sealant that does not contain organotin and is compatible with platinum cured silicone. It has the characteristics of shear thinning and no collapse, and has excellent bonding strength to various materials.

Wacker 949UV silicon gel encapsulation UV curing

WAKE SEMICOSIL 949UV A/B is a two-component UV activated room temperature fast curing silicone gel potting adhesive. Low viscosity, low hardness, process control can be achieved through UV lamps (including UV tracers), and can be used for PIN pin encapsulation and electronic component packaging protection.

Wacker 915HT silicon gel encapsulation high temperature resistant 210 ℃

WAKE SEMICOSIL 915HT is a high temperature resistant silicon gel, which can maintain excellent performance at 210 ℃ for a long time The main agent 915HT can be combined with different curing agents to achieve heating or UV curing, meeting different process requirements

Wacker 9806 sealing silicone with high adhesive strength

Wacker 9806 is a single component heat cured adhesive sealant with fast curing speed and high bonding strength, which can be used for sealing shells of various materials

Wacker 912 silicon gel encapsulation UV or heat curing

Wacker SEMICOSIL 912 is a two-component 10:1 silicon gel that can be used with different curing agents to achieve heat curing or UV curing. Low viscosity, low hardness, widely used for packaging and protection of sensors and electronic components.

Wacker 9620 TC Thermal Conductive Joint Filler Low Stress

Wacker SEMICOSIL 9620TC A/B is a two-component room temperature cured silicone thermal conductive sealant with low stress, soft and self-tacky surface, low density, and thermal conductivity of 2.0W/mK. Can be used for thermal sealing of new energy vehicle components.

Wacker 9639TC thermal sealant 3 W/(m·K)

Wacker SEMICOSIL 9639TC A/B is a two-component room temperature cured silicone thermal conductive sealant with low stress, soft and self-adhesive surface, low density, and thermal conductivity of 3.0W/mK. Can meet the heat dissipation needs of electronic components and battery packs.

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